Method for manufacturing the same

ABSTRACT

A circuit board with reduced dielectric losses enabling the movement of high frequency signals includes an inner circuit board and two outer circuit boards. The inner circuit board includes a first conductor layer and a first substrate layer. The first conductor layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductor layer and defines first through holes which expose the signal line. Each outer circuit board includes a second substrate layer and a second conductor layer. The second substrate layer abuts the inner circuit board and defines second through holes which are not aligned with the first through holes, partially surrounding the signal line with air which has a very low dielectric constant. A method for manufacturing the high-frequency circuit board is also disclosed.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a divisional application of patent application Ser. No.17/029,355 filed on Sep. 23, 2020, which is based on and claims priorityto China Patent Application No. 202010494280.1 filed on Jun. 3, 2020,the contents of which are incorporated by reference herein.

FIELD

The subject matter herein generally relates to printed circuit boards,in particular to a high-frequency circuit board and a method formanufacturing the same.

BACKGROUND

In high-frequency electronic signal transmissions, attenuation of thetransmission signal is mainly a result of dielectric losses. Dielectricloss is positively correlated with dielectric loss factor and dielectricconstant. In order to reduce the transmission loss, a liquid crystalpolymer with a low dielectric constant can be used as the substratelayer covering the signal line. However, such material still has arelatively high dielectric loss.

BRIEF DESCRIPTION OF THE DRAWINGS

Implementations of the present technology will now be described, by wayof embodiment, with reference to the attached figures.

FIG. 1 is a cross-sectional view of an embodiment of a high-frequencycircuit board.

FIG. 2A is a top view of a first conductor layer of the high-frequencycircuit board of FIG. 1.

FIG. 2B is a top view of a first substrate layer of the high-frequencycircuit board of FIG. 1.

FIG. 2C is a top view of a second substrate layer of the high-frequencycircuit board of FIG. 1.

FIG. 3 is a cross-sectional view of an inner circuit board in oneembodiment.

FIG. 4 is a cross-sectional view showing two copper clad laminatesprovided on two sides of the inner circuit board of FIG. 3.

FIG. 5 is a cross-sectional view showing the copper clad laminates andthe inner circuit board of FIG. 3 pressed together.

FIG. 6 is a cross-sectional view showing a plurality of vias formed onthe structure of FIG. 5.

FIG. 7 is a cross-sectional view showing a plurality of conductivepillars formed on the structure of FIG. 6.

DETAILED DESCRIPTION

Implementations of the disclosure will now be described, by way ofembodiments only, with reference to the drawings. The disclosure isillustrative only, and changes may be made in the detail within theprinciples of the present disclosure. It will, therefore, be appreciatedthat the embodiments may be modified within the scope of the claims.

Unless otherwise defined, all technical terms used herein have the samemeaning as commonly understood by one of ordinary skill in the art. Thetechnical terms used herein are to provide a thorough understanding ofthe embodiments described herein, but are not to be considered aslimiting the scope of the embodiments.

FIG. 1 illustrates a high-frequency circuit board 100 according to oneembodiment. The high-frequency circuit board 100 includes an innercircuit board 10, and two outer circuit boards 30 disposed on oppositetwo surfaces of the inner circuit board 10.

The inner circuit board 10 is a single-sided circuit board, and includesa first substrate layer 11 and a first conductor layer 13 disposed on asurface of the first substrate layer 11.

As shown in FIG. 2A, the first conductor layer 13 is made of copper, andincludes a signal line 131 and two ground lines 132. The two groundlines 132 are arranged at intervals on both sides of the signal line131. The first conductor layer 13 defines a plurality of slots 134passing through the first conductor layer 13. Each slot 134 isolates oneground line 132 from the signal line 131.

As shown in FIG. 2B, the substrate layer 11 includes a first openingregion 111 and a first non-opening region 113 connected to each other.The first opening region 111 corresponds in position to the signal line131. In a width direction W of the high-frequency circuit board 100, awidth of the first opening region 111 is not greater than a width of thesignal line 131. The first opening region 111 defines a plurality offirst through holes 114, and the signal line 131 is exposed in the firstthrough holes 114. Each of the first through holes 114 penetrates asurface of the first substrate layer 11 abutting the first conductorlayer 13 and a surface of the first substrate layer 11 away from thefirst conductor layer 13. A cross-section of each of the first throughholes 114 may be round, slot-like, or the like. The first through holes114 are arranged at intervals along a length direction of the signalline 131.

The first substrate layer 11 may be a rigid resin layer, such as aprepreg (PP) layer including glass fiber and epoxy resin, or may be aflexible resin layer, such as a polyethylene naphthalate (PEN) layer, apolyimide (PI) layer, a polyethylene terephthalate (PET) layer, apolytetrafluoroethylene (Teflon) layer, a polythiamine (PA) layer, apoly methyl methacrylate (PMMA) layer, a polycarbonate (PC) layer, or apolyimide-polyethylene-terephthalate copolymer layer. In one embodiment,the first substrate layer 11 is made of a material having a dielectricconstant of less than 3.5, such as polyethylene naphthalate.

The two outer circuit boards 30 are arranged at outer sides of the firstsubstrate layer 11 and the first conductor layer 13. Each of the twoouter circuit boards 30 includes a second substrate layer 31 and asecond conductor layer 33. The second substrate layer 31 is in contactwith the inner circuit board 10, and the second conductor layer 33covers a surface of the second substrate layer 31 away from the innercircuit board 10.

As shown in FIG. 2C, the second substrate layer 31 includes a secondopening region 311 and a second non-opening region 313 connected to eachother. The second opening region 311 corresponds in position to thesignal line 131. In the width direction W of the high-frequency circuitboard 100, a width of the second opening region 311 is not less than thewidth of the signal line 131. The second opening region 311 defines aplurality of second through holes 314, and the signal line 131 isexposed in the second through holes 314. Each of the second throughholes 314 penetrates a surface of the second substrate layer 31 abuttingthe inner circuit board 10 and a surface of the second substrate layer31 away from the inner circuit board 10. A cross-section of each of thesecond through holes 314 may be round, or slot-like, or the like. Thesecond through holes 314 are arranged at intervals along a lengthdirection of the signal line 131.

The second through holes 314 are not aligned with the first throughholes 114, preventing copper foils of a copper laminate from collapsingduring the pressing of the copper laminate on the inner circuit board10. In one embodiment, in a thickness direction of the high-frequencycircuit board 100, projections of the second through holes 314 andprojections of the first through holes 114 alternate with each other.

The second substrate layer 31 may be a rigid resin layer or a flexibleresin layer. The second substrate layer 31 and the first substrate layer11 may be made of the same or different materials. In one embodiment,the second substrate layer 31 is made of a material having a dielectricconstant of less than 3.5.

In an alternative embodiment, the high-frequency circuit board 100further includes two adhesive layers 40. The two adhesive layers 40attach the two outer circuit boards 30 to the inner circuit board 10.One adhesive layer 40 is sandwiched between the first substrate layer 11and the second substrate layer 31 of one outer circuit board 30, and theother adhesive layer 40 is sandwiched between the first conductor layer13 and the second substrate layer 31 of the other outer circuit board30. Each of the adhesive layers 40 defines an opening 41. In the widthdirection of the high-frequency circuit board 100, a width of theopening 41 is greater than the width of the signal line 131 and is lessthan a straight-line distance between the two ground lines 132. Thesignal line 131 is in the opening 41 of one adhesive layer 40, and theadhesive layer 40 partially infills the slots 134.

The second conductor layers 33 function as shielding layers of thesignal line 131. The high-frequency circuit board 100 further includes aplurality of conductive pillars 60 on both sides of signal line 131. Theconductive pillars 60 are electrically connected to the second conductorlayers 33 and the ground lines 132. The conductive pillars 60, thesecond conductor layers 33, and the ground lines 132 surround the signalline 131 and together act as a shield preventing electromagneticinterference from the environment in the signal line 131. Someconductive pillars 60 located on one side of the signal line 131 arearranged at equal or non-equal distances along the length direction ofthe signal line 131. In one embodiment, each of the conductive pillars60 penetrates the first substrate layer 11, two adhesive layers 40, andtwo second substrate layers 31, and is electrically connected to oneground line 132 and two second conductor layers 33.

The high-frequency circuit board 100 further includes two protectivelayers 70. The two protective layers 70 are arranged on two outer sidesof the two outer circuit boards 30 and protect the second conductorlayers 33. In one embodiment, the protective layers 70 are coveringlayers. In other embodiment, the protective layers 70 may be solderresisting layers. The two protective layers 70 may be attached to theouter sides of the two outer circuit boards 30 by adhesive layers 40.

One embodiment of a method for manufacturing a high-frequency circuitboard includes the steps of:

S1, providing an inner circuit board including a first substrate layerand a first conductor layer on a surface of the first substrate layer,the first conductor layer including a signal line and two ground linesarranged at intervals on both sides of the signal line, and the firstsubstrate layer having a plurality of first through holes correspondingto the signal line;

S2, providing two copper clad laminates, each of the two copper cladlaminates including a second substrate layer and a copper foil on asurface of the second substrate layer, the second substrate layer havinga plurality of second through holes;

S3, pressing together the two copper clad laminates on two sides of theinner circuit board, the second substrate layer abutting the innercircuit board, and the second through holes non-aligned with the firstthrough holes;

S4, forming a second conductor layer on the copper foil to obtain thehigh-frequency circuit board.

As shown in FIG. 3, in step S1, an inner circuit board 10 is provided.The inner circuit board 10 includes a first substrate layer 11 and afirst conductor layer 13 disposed on a surface of the first substratelayer 11. The first conductor layer 13 includes a signal line 131 andtwo ground lines 132. The two ground lines 132 are arranged at intervalson both sides of the signal line 131. The first substrate layer 11defines a plurality of first through holes 114, and the signal line 131is exposed in the first through holes 114.

The first conductor layer 13 is made of copper, and includes a signalline 131 and two ground lines 132. The first conductor layer 13 definesslots 134 passing through the first conductor layer 13. Each slot 134isolates one ground line 132 from the signal line 131. The firstsubstrate layer 11 covers one side of the first conductor layer 13.

The substrate layer 11 includes a first opening region 111 and a firstnon-opening region 113 connected to each other. The first opening region111 corresponds in position to the signal line 131. In a width directionW of the high-frequency circuit board 100, a width of the first openingregion 111 is not greater than a width of the signal line 131. The firstopening region 111 defines first through holes 114, and the signal line131 is exposed in the first through holes 114. Each of the first throughholes 114 penetrates a surface of the first substrate layer 11 abuttingthe first conductor layer 13 and a surface of the first substrate layer11 away from the first conductor layer 13. A cross-section of each ofthe first through holes 114 may be round, slot-like, or the like. Thefirst through holes 114 are arranged at intervals along a lengthdirection of the signal line 131. The first through holes 114 may beformed by laser cutting or punching.

The first substrate layer 11 may be a rigid resin layer, such as aprepreg (PP) layer including glass fiber and epoxy resin, or may be aflexible resin layer, such as a polyethylene naphthalate (PEN) layer, apolyimide (PI) layer, a polyethylene terephthalate (PET) layer, apolytetrafluoroethylene (Teflon) layer, a polythiamine (PA) layer, apoly methyl methacrylate (PMMA) layer, a polycarbonate (PC) layer, or apolyimide-polyethylene-terephthalate copolymer layer. In one embodiment,the first substrate layer 11 is made of a material having a dielectricconstant of less than 3.5, such as polyethylene naphthalate.

As shown in FIG. 4, in step S2, two copper clad laminates 80 areprovided. Each of the two copper clad laminates 80 includes a secondsubstrate layer 31 and a copper foil 81 on a side of the secondsubstrate layer 31. The second substrate layer 31 has second throughholes 314.

The second substrate layer 31 includes a second opening region 311 and asecond non-opening region 313 connected to each other. The secondopening region 311 corresponds in position to the signal line 131. Inthe width direction W of the high-frequency circuit board 100, a widthof the second opening region 311 is not less than the width of thesignal line 131. The second opening region 311 defines second throughholes 314. The second through holes 314 may be formed by laser cuttingor punching.

The second substrate layer 31 may be a rigid resin layer or a flexibleresin layer. The second substrate layer 31 and the first substrate layer11 may be made of the same or different materials. In one embodiment,the second substrate layer 31 is made of a material having a dielectricconstant of less than 3.5.

As shown in FIG. 5, the two copper clad laminates 80 are pressed ontoopposite two sides of the inner circuit board 10, the second substratelayer 31 abuts the inner circuit board 10, and the second through holes314 are not aligned with the first through holes 114. In one embodiment,in a thickness direction of the high-frequency circuit board 100,projections of the second through holes 314 and projections of the firstthrough holes 114 alternate with each other.

In an alternative embodiment, the two copper clad laminates 80 areadhered to two sides of the inner circuit board 10 by adhesive layers40. One adhesive layer 40 is sandwiched between the first substratelayer 11 and the second substrate layer 31 of one outer circuit board30, and the other adhesive layer 40 is sandwiched between the firstconductor layer 13 and the second substrate layer 31 of the other outercircuit board 30. The adhesive layers 40 may be prepregs. Each of theadhesive layers 40 defines an opening 41. In the width direction of thehigh-frequency circuit board 100, a width of the opening 41 is greaterthan the width of the signal line 131 but less than a straight-linedistance between the two ground lines 132. After being pressed together,the signal line 131 is in the opening 41 of one adhesive layer 40, andthe adhesive layer 40 partially infills the slots 134.

As shown in FIGS. 6 and 7, after step S3, the method further includes astep of forming conductive pillars 60. The conductive pillars 60 arelocated on both sides of signal line 131, and are electrically connectedto the ground lines 132 and the copper foils 81 of the copper cladlaminates 80.

Specifically, each of the conductive pillars 60 is formed by forming avia 61 on the first substrate 11, the two adhesive layers 40, and thetwo substrate layers 31, the ground line 132 being exposed in the via61. The via 61 is infilled or electroplated with conductive materials toform the conductive pillar 60.

As shown in FIG. 1 and FIG. 7, in step S4, two conductor layers 33 areformed on the two copper foils 81 to obtain the high-frequency circuitboard 100. The copper foils 81 undergoes a photolithography process toform the second conductor layers 33. One second conductor layer 33 andone second substrate layer 31 constitute one outer circuit board 30.

After forming the second conductor layers 33, the method furtherincludes the step of forming two protective layers 70 on two outer sidesof the two outer circuit boards 30. The protective layers 70 protect thesecond conductor layers 33. In one embodiment, the protective layers 70are covering layers. In other embodiment, the protective layers 70 maybe solder resisting layers. The two protective layers 70 may be attachedto the outer sides of the two outer circuit boards 30 by two adhesivelayers 40.

In the high-frequency circuit board 100, the first substrate layer 11 ofthe inner circuit board 10 and the second substrate layers 31 of theouter circuit boards 30 all define through holes corresponding to thesignal line 131. The signal line 131 is at least in part surrounded byair, air having a very low dielectric constant, attenuation of thesignal line 131 during transmission is thereby reduced. The secondthrough holes 314 are non-aligned with the first through holes 114, soas to prevent the copper foils 81 of the copper laminates 80 fromcollapsing during the pressing together of the copper laminates 80 onthe inner circuit board 10.

While the present disclosure has been described with reference toparticular embodiments, the description is illustrative of thedisclosure and is not to be construed as limiting the disclosure.Therefore, those of ordinary skill in the art can make variousmodifications to the embodiments without departing from the scope of thedisclosure as defined by the appended claims.

What is claimed is:
 1. A method for manufacturing a high-frequencycircuit board comprising: providing an inner circuit board including afirst substrate layer and a first conductor layer on a surface of thefirst substrate layer, the first conductor layer including a signal lineand two ground lines arranged at intervals on both sides of the signalline, the first substrate layer having a plurality of first throughholes corresponding to the signal line; providing two copper cladlaminates, each of the two copper clad laminates comprising a secondsubstrate layer and a copper foil on a surface of the second substratelayer, the second substrate layer having a plurality of second throughholes; pressing the two copper clad laminates on two sides of the innercircuit board, the second substrate layer abutting the inner circuitboard, and the second through holes non-aligned with the first throughholes; and forming a second conductor layer from the copper foil.
 2. Themethod of claim 1, wherein the two copper clad laminates are adhered onthe two sides of the inner circuit board by two adhesive layers, each ofthe two adhesive layers defines an opening exposing the signal line. 3.The method of claim 2, wherein in a width direction of thehigh-frequency circuit board, a width of the opening is greater than awidth of the signal line and is less than a straight-line distancebetween the two ground lines.
 4. The method of claim 2, wherein one ofthe two adhesive layers is sandwiched between the first substrate layerand the second substrate layer of one of the two copper clad laminates,and the other layer of the two adhesive layers is sandwiched between thefirst conductor layer and the second substrate layer of the other of thetwo copper clad laminates.
 5. The method of claim 1, wherein the firstsubstrate layer comprises a first opening region, the plurality of firstthrough holes are located in the first opening region; the secondsubstrate layer comprises a second opening region, the plurality ofsecond through holes are located in the second opening region; in thewidth direction of the high-frequency circuit board, a width of thefirst opening region is not greater than the width of the signal line,and a width of the second opening region is not less than the width ofthe signal line.
 6. The method of claim 1, further comprising forming aplurality of conductive pillars after pressing the two copper cladlaminates, wherein the plurality of conductive pillars are located onboth sides of the signal line, and each of the plurality of conductivepillars electrically connects one of the two ground lines and the copperfoil.
 7. The method of claim 1, further comprising forming twoprotective layers on two second conductor layers.
 8. The method of claim1, wherein each of the plurality of first through holes penetrates asurface of the first substrate layer abutting the first conductor layerand a surface of the first substrate layer facing away from the firstconductor layer, the plurality of first through holes are arranged atintervals along a length direction of the signal line.
 9. The method ofclaim 1, wherein each of the plurality of second through holespenetrates a surface of the second substrate layer abutting the innercircuit board and a surface of the second substrate layer facing awayfrom the inner circuit board, the plurality of second through holes arearranged at intervals along a length direction of the signal line.